Product Details for Material from Chip Quik Inc - SMDLTLFP500T4C - SOLDER PASTE LOW TEMP T4 500G Lead Free No-Clean Solder Paste Sn42Bi57.6Ag0.4 (42/57.6/0.4)

SMDLTLFP500T4C Chip Quik Inc SOLDER PASTE LOW TEMP T4 500G Lead Free No-Clean Solder Paste Sn42Bi57.6Ag0.4 (42/57.6/0.4)

Part Nnumber
SMDLTLFP500T4C
Description
SOLDER PASTE LOW TEMP T4 500G Lead Free No-Clean Solder Paste Sn42Bi57.6Ag0.4 (42/57.6/0.4)
Producer
Chip Quik Inc
Basic price
149,46 EUR

The product with part number SMDLTLFP500T4C (SOLDER PASTE LOW TEMP T4 500G Lead Free No-Clean Solder Paste Sn42Bi57.6Ag0.4 (42/57.6/0.4)) is from company Chip Quik Inc and distributed with basic unit price 149,46 EUR. Minimal order quantity is 1 pc, Approx. production time is 28 weeks.


Categories Soldering, Desoldering, Rework Products Solder Manufacturer Chip Quik Inc. Series - Part Status Active Process Lead Free Type Solder Paste Flux Type No-Clean Composition Sn42Bi57.6Ag0.4 (42/57.6/0.4) Wire Gauge - Diameter - Core Size - Melting Point 281°F (138°C) Shelf Life 6 Months (Date of Manufacture) (Refrigerated)


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(keyword SMDLTLFP500T4C Chip Quik Inc SOLDER PASTE LOW TEMP T4 500G Lead Free No-Clean Solder Paste Sn42Bi57.6Ag0.4 (42/57.6/0.4))
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